Equipment List
Wire Bond Equipment
All wire bonding operations are housed in a Class 10000 clean room.
- Automatic ball bonders (4)
- Automatic wedge bonders (4)
- Manual bonders (3)
- March PX-250 Plasma etch system
- Royce System 552 Pull tester
- Nikon stereo zoom microscope & Nikon XYZ microscope
Die Attach
Die bonding operations are housed in a Class 10K clean room.
- DataCon 2200 APM Multi Chip die bonder
- SEC850 Flip chip attach system:
- MRSI 170 - 2 units are available for epoxy, solder paste or flux
dispense
- Pick-and-Place Manncorp Model EXP/M - 4 units are in operation.
- Asymtek epoxy dispense stations (2)
- Epoxy Curing - Several types of epoxy and thermo plastic materials
are used for attaching die and components, encapsulating die and wire bonds, attaching rings and caps, etc. These materials are cured either thermally or by the effect of a UV light source.
- Blue M box ovens with micro processor controlled heating system (5)
- Blue M oven with inert atmosphere chamber
- Despatch LAC1 oven with micro processor controlled heating system
(2)
- Mannix TSC1210 belt furnace
- Loctite Zeta Model 7050A UV curing station
- American Ultra Violet belt furnace
- Dage BT22-PC die shear tester
Soldering operations
Soldering operations are housed in a class 100K clean room. Soldering processes utilizing low temperature eutectic tin/lead solder, high temperature tin/lead solder and lead free solder have been qualified.
Solder dispense:Each working bench is equipped with an EFD dispense unit.
- A Weltek screen printer Model 44 is used for volume dispense of
solder paste.
Solder reflow
- Each working bench is equipped with a Weller manual soldering
station.
- Micro-flame reflow station fueled by a hydrogen generator SAT model
205HP is used for high temperature reflow and localized reflow.
- Continuous reflow is provided by belt reflow furnaces. All belt
furnaces reflow solder in nitrogen atmosphere. Liquid nitrogen is used too provide clean gas, humidity and oxygen free atmosphere.
- Sikama 4-zones conduction belt furnace with controlled atmosphere
- RTC 6" 1-zone radiant heat belt furnace Model 206
- BTU 2.5" 3-zones forced convection belt furnace with controlled
atmosphere
- Watkins Johnson 12" 10-zones forced convection belt furnace with
controlled atmosphere and oxygen monitoring
Surface cleaning
- Baron-Blakeslee Model MLR-120 spray degreaser is used to remove
residual flux when high temperature solder is used. A stabilized, halide free solvent, Ensolv is used.
- Ionox FCR is used as water soluble solvent. The wet station is
composed of an ultrasonic cleaner followed by rinsing in Iso-Propyl alcohol and de-ionized water. Drying is performed in cold air.
Inspection & Test station
- Bausch & Lomb stereo microscopes are used for visual inspection
- Nikon Optiphot microscopes with magnification to 200x are used for
failure analysis
- Multimeters and power supplies are used for electrical testing of
circuits.
Other Peripheral equipment
- Lead frame singulation
- Lead frame trim & form station
- PCB singulation
- Heat seal tape attach system
- Fine & gross leak detection system
Stud Bumping
The stud bump is a method for connecting semiconductor devices onto a wide range of circuit board materials. The stud bump is attached directly onto standard, wire bond pads and can be manufactured from any of the materials normally used for wire bonding.
Customizing
The shape of the stud bump can be customized, for each application, to optimize electrical performance and mechanical reliability and will allow semiconductor die, with <150 micron pitch pads, to be flipped directly onto FR4, without the need for an underfill. For an overview of our stud bump process, click here.
Cost Effective
The stud bump process is extremely cost effective and can be carried out on individual die, either at the wafer level or after singulation. The unique manufacturing methodology can even accommodate full electrical testing, including Burn-In.
Techniques
Once stud bumped, the die can be attached using a wide range of techniques; Thermocompression and thermosonic bonding, reflow soldering and conductive, z-axis and even non-conductive adhesives.
Current Capability
- Pitch 80 um
- Pad Size 50 um
- Height 3-5 x Wire Diameter
- Wire Type Au & Au/Pd
- Wire Diameter 25 um
Substrate Attachment
- Conductive Epoxy
- Solder Alloy
- Non-Conductive Paste
- Thermocompression
- Thermosonic
- Underfill
Bumping
- Wafer or Single Die
- Standard Equipment
Applications
- COB
- PIN Diodes
- Sub-Zero Probe-Card
- Si/Ge
- Hi-Speed Ga/As
- Medical Sensors
- DCA
- Ect.
